Nickel-boron alloy sputtering targets are sputtering coating materials made primarily of nickel (Ni) and boron (B) through a high-purity densification process. They are commonly used in semiconductors, optical thin films, and solar cells. Nickel-boron functional thin films are deposited on substrate surfaces using physical vapor deposition (PVD) techniques such as magnetron sputtering.
Preparation Methods of Nickel-Borne Alloy Sputtering Targets
Raw Material Preparation: High-purity nickel powder and high-purity boron powder are selected as raw materials.
Forming: Cold isostatic pressing is commonly used. The powder is filled into an elastic mold (such as a rubber mold) and sealed. Then, it is placed in a high-pressure container, and isotropic high pressure (e.g., 200-400 MPa) is applied through a liquid medium (oil or water) to press it into a "green blank" with a certain strength.
Sintering: In a vacuum environment, high temperature (usually below the melting point of nickel, approximately 1000-1200℃) and unidirectional pressure are applied to the blank simultaneously to obtain a high-density alloy bulk.
Subsequent processing: Using lathes, milling machines, grinding machines, etc., the sintered blanks are precisely processed to the final dimensions required by the customer.
Applications of Nickel-Boron Alloy Sputtering Targets
Surface Protective Coating: Depositing nickel-boron thin films on the surfaces of easily worn parts such as bearings, gears, molds, and cutting tools can significantly extend their service life.
Electronics Industry: Utilizing its adjustable resistivity, it can be used to manufacture high-precision, high-stability thin-film resistors.
Optics Industry: Due to its dense and stable properties, it is sometimes used as a protective coating for certain optical lenses.
